Showing posts with label Simulation. Show all posts
Showing posts with label Simulation. Show all posts

Wednesday, October 26, 2016

COMSOL Issues Multiphysics Simulation 2016 Edition

BURLINGTON, MA, USA, Oct 26, 2016 - COMSOL, Inc. the leading provider of multiphysics modeling, simulation, and application design and deployment software, is excited to announce that the latest edition of Multiphysics Simulation is now available. The 2016 edition features articles on a range of topics, including 5G simulation apps, implantable medical devices, organic LEDs, and high efficiency photonic switches.

“Multiphysics simulation tools are being used across many industries with great success,” comments Bernt Nilsson, Senior VP of Marketing with COMSOL, Inc. “The Multiphysics Simulation magazine is a compilation of a dozen outstanding product and research projects. In every case, numerical simulation has a major impact on the outcome for organizations that are now expanding the use of simulation to much larger groups of users.”

This edition of Multiphysics Simulation shares a number of stories about how simulation experts are communicating their simulation work with colleagues and customers. A few highlights:
  • Researchers at GrafTech developed a detailed model of graphite heat spreaders and turned it into a simulation app for their sales team.
  • Within Konica Minolta researchers are using multiphysics simulation to increase light output and energy efficiency in organic LED (OLED) systems.
  • The team at Huawei is hard at work designing energy efficient photonic switches to support growing network traffic.
Other articles highlight how industry leaders have employed simulation driven product development practices to stay ahead of the competition. Researchers at St. Jude Medical are using multiphysics simulation to enhance the performance and safety of wireless implantable devices for heart disease patients. The team at ArcelorMittal is perfecting the process for laser welding within the automotive industry.

Availability

Multiphysics Simulation 2016 is available as an online magazine and can be viewed digitally or downloaded in PDF format at: https://www.comsol.com/offers/mphsim16.

About COMSOL

COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics product is an integrated software environment for creating physics-based models and simulation apps. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electrical, mechanical, fluid flow, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics simulations with all major technical computing and CAD tools on the CAE market. Simulation experts rely on the COMSOL Server product to deploy apps to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL employs more than 480 people in 21 offices worldwide and extends its reach with a network of distributors. For more information, visit https://www.comsol.com.

Saturday, October 8, 2016

COMSOL Offers Rotordynamics Module, Performance Improvements at Boston Conference

BURLINGTON, MA, USA, Oct 8, 2016 - COMSOL, Inc. the leading provider of software solutions for multiphysics modeling, simulation, app design and deployment, provided attendees with the latest updates of COMSOL Multiphysics software, COMSOL Server product, and COMSOL Client at the 12th annual COMSOL Conference Boston. The latest update of the COMSOL software features major performance increases and the release of the Rotordynamics Module, which is now available as an add-on product to the Structural Mechanics Module.

Performance Improvements for the Handling of Large Models


The latest version of COMSOL software provides up to a 10x speedup for the handling of large models and mesh creation. A combination of a tetrahedral and swept mesh of a gas turbine is shown.

The latest update of the COMSOL software provides significant performance improvements compared to versions made available a year ago. The speedup is most notable with respect to the handling of models with several thousand domains and boundaries.

COMSOL is committed to continue its strive to deliver the most efficient and robust multiphysics environment for its wide range of products for electrical, mechanical, acoustics, fluid, thermal, and chemical simulations. “To fulfil this commitment, COMSOL’s development team ensures that each update of the COMSOL software provides more efficient solvers, meshing, and physics modeling functionality”, comments Bjorn Sjodin, VP of Product Management, COMSOL, Inc.

The Future of Simulation: Application Design and Deployment

This app created with COMSOL Multiphysics software allows, the user to evaluate the structural stress in a bike frame for varying dimensions, materials, and loading conditions.

Svante Littmarck, President and CEO, COMSOL, Inc. showcased examples of how customers are leveraging simulation apps to enable company-wide usage of multiphysics simulation. “These case studies provide us with a first look at how our customers benefit from building and deploying simulation apps,” said Littmarck in his keynote presentation, “The Application Builder and COMSOL Server are the tools that organizations need in order to provide multiphysics for everyone.”

The Application Builder has enabled simulation specialists to create multiphysics apps, based on their detailed models, through custom interfaces that can be easily accessed via COMSOL Client or a web browser connecting to a local installation of COMSOL Server.

Custom applications can be created for anyone from technicians, support staff, designers, to customer service representatives, empowering them to make on-the-fly design iterations and report generation.

With COMSOL Server organizations can deploy industry-specific analysis tools in a dynamic, streamlined, quick to implement format that can be scaled for global benefit.

Release of the Rotordynamics Module

Pressure distribution in the lubricant of the bearings (rainbow color plot), von Mises stress (blue color plot), and displacement of the bearings (orbit plot) resulting from a rotordynamics analysis.

The latest update of the COMSOL software product suite includes the new Rotordynamics Module, which will aid engineers in analyzing vibrations due to centrifugal forces and other gyroscopic effects in rotating machinery. This new product will be used to ensure that rotor vibrations are contained within acceptable design limits by providing functionality for evaluating critical speed, whirl, and bearings. This module will be of particular interest to those working with the design of turbines, turbochargers, electrical machinery, and pumps in the automobile, marine, aerospace, energy, and household appliance industries.

“With the Rotordynamics Module, users can take into account the effects of various components such as disks, bearings, and foundations,” explains Prashant Srivastava, a Technical Product Manager at COMSOL. “Users will also be able to easily postprocess their results directly within the software to present the results of their analysis as Campbell diagrams, modal orbits, harmonic orbits, waterfall plots, and whirl plots.”

The new module works in concert with the other COMSOL products. For example, additional tools for modeling geared rotors are available when the Rotordynamics Module is combined with the Multibody Dynamics Module.

Availability

To download the latest version of COMSOL Multiphysics software and COMSOL Server product or update your current installation, visit www.comsol.com/product-update.

COMSOL software products are supported on Windows, Linux, and mac OS. The Application Builder is supported on Windows.

About COMSOL

COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics product is an integrated software environment for creating physics-based models and simulation apps. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electrical, mechanical, fluid flow, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics simulations with all major technical computing and CAD tools on the CAE market. Simulation experts rely on the COMSOL Server product to deploy apps to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL employs more than 480 people in 21 offices worldwide and extends its reach with a network of distributors. For more information, visit www.comsol.com.

Tuesday, September 27, 2016

MSC Announces Apex Fossa for CAE

NEWPORT BEACH, CA, USA, Sep 27, 2016 - MSC Software Corporation announced the sixth release of MSC Apex, the company's next-generation Computer Aided Engineering (CAE) platform. MSC Apex Fossa is the winner of 13 product awards and 25 patent filings to date, is the result of 450+ man years of software development and is in use in over 300 companies' worldwide. Now on its sixth release, Apex has advanced from a highly productive model-preparation tool to a complete simulation system.

Redefining Vibrational Analysis

Examples of problems related to vibrations can be found everywhere. Vibration has to be addressed anytime a part or an assembly is subjected to a cyclic load, such as those found in cars, airplanes, consumer equipment, and so on. Currently, addressing these issues is a tedious trial-and-error process.

Apex Fossa allows design exploration to happen in the analysis result space, without having to go back to CAD and redesign the entire part or assembly. This dramatically reduces the time for a power-user to achieve the optimal solution (from days to hours) and democratizes vibrational analysis, making it accessible to more engineers.

Engineers can now see how a part or a structure responds to input parameters in real-time. Users can explore a large variety of "what if" scenarios, by adding or removing mass, damping or stiffness, as well as determine if they are observing a global or local behavior without leaving the Apex environment. This allows engineers to rapidly determine which part of the structure is not behaving as expected, and to quickly propose an effective solution.

Release Highlights:
  • Modeling - Even more productivity can be achieved in geometry clean-up, mesh generation and clean-up. This includes new connections, loads and boundary conditions (such as local coordinate system, distributed coupling, moments and dynamic forces), new meshing enhancements, geometry tools (such as slicing mirroring and Boolean operators), and additional export formats.
  • Simulation - Computational parts-based generative framework has been extended from linear statics to now include the first phase of dynamics, Frequency Response. This includes Structural, Modal, and Material Damping, Multi-Step Analysis, Point Sensor, XY-Plotting and Frequency Response results exploration.
  • Extensibility- Initial Python scripting capability is introduced in Apex Fossa. Python API has been carefully designed for compliance with Python standards. The API is based on true Python idioms and uses built-in, native Python data structures. The Python community of rich libraries makes customization powerful and easy.
Apex Fossa makes the CAD-to-Mesh process radically faster, gives more engineers access to frequency response analysis and makes the overall FEA process more effective, more efficient and more enjoyable. 

Availability

Apex Fossa will be available for general release at the end of September.

About MSC Software

MSC Software is one of the ten original software companies and a global leader in helping product manufacturers to advance their engineering methods with simulation software and services. As a trusted partner, MSC Software helps companies improve quality, save time, and reduce costs associated with design and test of manufactured products. Academic institutions, researchers, and students employ MSC's technology to expand individual knowledge as well as expand the horizon of simulation. MSC Software employs 1,200 professionals in 20 countries. For more information about MSC Software's products and services, visit www.mscsoftware.com.

Sunday, June 19, 2016

MSC Nastran, Patran 2016 for CAE Released

NEWPORT BEACH, CA, USA, Jun 19, 2016 - MSC Software Corporation announced new releases of MSC Nastran and Patran. MSC Nastran 2016 delivers dramatic performance and speed improvements as well as new multidisciplinary analysis solutions. Patran 2016 improves support for nonlinear and fatigue analysis capabilities.

Release highlights of MSC Nastran:

Performance
  • MSC Nastran 2016 uses enhanced Automated Component Mode Synthesis (ACMS) method with Shared Memory Parallel (SMP) computing delivering better performance and ability to effectively use more cores for higher user productivity. 50% parallel efficiency has been observed for 16 processors. SMP Parallelization can now be used to reduce the overall wall time stiffness matrix computations and stress recovery. 75% parallel efficiency has been achieved with 4 threads with the job running 3 times faster than with one processor.
  • Availability of Intel MKL Pardiso solver has been extended to provide better scalability, thereby lowering the overall elapsed time of simulations.
3D Rotor Dynamics
  • With the new 3D modelling capability, users can now model discrete blades and non-symmetric components of rotors and stators of rotating machinery, turbines and jet engines improving the accuracy of the rotor dynamic analyses. This type of modelling was not possible with 1D or 2.5D modelling solutions. With 3D modelling, engineers can now see what is happening locally at each blade or at the component level.
Dynamics and NVH
  • Equivalent Radiated Power (ERP) can now be output for higher order shell and solid elements. It is also possible to output velocity normal to the surface and vibration intensity.
  • Multiple load vectors produced by Actran can now be selectively incorporated in MSC Nastran's frequency response analysis.
  • Efficiency of large poroelastic material simulations is improved with access to out-of-core solver of Actran.
Optimization
  • New in this release is Global Optimization (GO) which combines automatic multi-start global methods and gradient based local optimization methods. This approach searches the complete design space for the best possible solutions. The new capability was implemented to help automotive and aerospace companies to lightweight safely while optimizing their designs.
  • Multi-model optimization (MMO) provides the ability to process separate design models with different topology or analyses to perform combined optimization. This capability is enhanced to solve larger problems and without limit on the number of models.
MSC Nastran Embedded Fatigue
  • To maintain consistency with other fatigue solvers, nodal averaged stresses and strains are used for faster computation speed and a more realistic fatigue damage factors.
  • Skinning is implemented to create a 2D stress state on the surface of the model leading to fewer calculation points and enabling multi-axial assessments and correction on 3D solid elements.
Advanced Nonlinear
  • Beam contact is implemented with segment-to-segment contact algorithm and support for general beam cross section, tube-in-tube contact, including beam offsets, reducing computational cost and providing better accuracy.
  • Interference fit analysis common to engineering applications is enhanced to handle large interferences/overlaps.
Explicit Analysis
  • Three new models have been introduced to simulate complex material behaviour, namely, a time dependent viscoelastic creep model, Thermo-elasto-viscous plastic creep model, and Riedel-Hiermaier-Thoma model for concrete materials.
  • Adaptive solid elements that transform to SPH particles which can help simulate the effects of debris after element failure
Results
  • In addition to the existing result formats, MSC Nastran 2016 introduces a new results database based upon the HDF5 standard, which is an open format that will allows easier access via public viewers, Python, Java or C++.
  • A new utility is available to provide output file data in easier to read format.
For more information about the new releases, watch the on-demand new release webinar at http://bit.ly/21uqMPw
.
About MSC Software

MSC Software is one of the ten original software companies and a global leader in helping product manufacturers to advance their engineering methods with simulation software and services. As a trusted partner, MSC Software helps companies improve quality, save time, and reduce costs associated with design and test of manufactured products. Academic institutions, researchers, and students employ MSC's technology to expand individual knowledge as well as expand the horizon of simulation. MSC Software employs 1,200 professionals in 20 countries. For more information about MSC Software's products and services, visit www.mscsoftware.com.

Saturday, June 18, 2016

COMSOL Multiphysics, Server v5.2a for CAE Released

BURLINGTON, MA, USA, Jun 18, 2016 - COMSOL, Inc. the leading provider of multiphysics modelling, simulation, and application design software, announced the latest release of the COMSOL Multiphysics and COMSOL Server simulation software environment. Hundreds of user-driven features and enhancements to COMSOL Multiphysics, COMSOL Server, and add-on products have been implemented with an emphasis on accuracy, usability, and productivity. From new solvers and methods, to application design and deployment tools, COMSOL software version 5.2a expands the electrical, mechanical, fluid, and chemical design and optimization capabilities.

Powerful New Tools for Multiphysics Simulation

In COMSOL Multiphysics 5.2a, three new solvers deliver faster and more memory efficient computations. The smoothed aggregation algebraic multi-grid (SA-AMG) solver has proven to be particularly efficient for linear elastic analysis, but is also applicable to many other types of analyses. This solver is very memory conservative, making it possible to run structural assemblies with millions of degrees of freedom on a standard desktop or laptop computer.

Thermoviscous acoustics simulation solved with the domain decomposition solver. Local acceleration, total acoustic pressure, and total thermo-viscous power dissipation density are shown. This COMSOL model is used to design microphones and speakers used in consumer products, such as, smartphones, tablets, and laptops. It consists of 2.5 million degrees of freedom and required 14 GB of RAM to solve. Previsously 120 GB were needed using a direct solver.

The domain decomposition solver has been optimized for handling large multiphysics models. “The domain decomposition solver provides simulation specialists with a robust and flexible technology to more efficiently compute strongly-coupled multiphysics applications which previously required a memory-hungry direct solver,” says Jacob Ystrom, Technical Manager of the numerical analysis department at COMSOL. “Using this solver, customers will benefit from improved efficiency when running on single computers, clusters, as well as when combined with other solvers such as the aggregation algebraic multigrid solver.”

A new explicit solver based on the discontinuous Galerkin (DG) method for acoustics in the time-domain is now available. “Combing the discontinuous Galerkin method with the new absorbing layers in the time-domain, results in a level of memory efficiency that will allow our customers to perform more realistic simulations than ever possible before, for a given memory size” says Mads Jensen, Technical Product Manager, Acoustics.

Building and Deploying Apps: Easy and Scalable for Global Use

The complete suite of computational tools provided by COMSOL Multiphysics software and its Application Builder allows simulation specialists to design and optimize their products and create apps for the benefit of colleagues and customers. Simulation apps allow users without any previous experience using simulation software to run the apps for their specific purpose. With version 5.2a, app designers can build even more dynamic apps where the appearance of the user interface can change during run time, centralize unit handling to better serve teams working across different countries, and include hyperlinks and videos.

This app example shipped with the Application Libraries included in COMSOL Multiphysics and COMSOL Server, can be used for the design of a magnetic induction device used for food processing.

Apps can be deployed throughout organizations using the COMSOL Client for Windows or web browser by connecting to a COMSOL Server installation. This provides a cost-effective solution for managing how apps are used, either by users within an organization or to an organization’s clients and customers worldwide. In this latest version, administrators can customize the visual appearance and style of COMSOL Server software for branding purposes, and set the number of pre-launched applications for high-usage cases.

“By providing our customers with the flexibility to customize the visual appearance and style of their COMSOL Server installation, they will be able to provide a cohesive brand experience that their colleagues and customers will be able to easily recognize and adopt into their existing processes,” says Svante Littmarck, President and CEO, COMSOL Inc. 

“The Application Builder allowed us to give other departments access to our analysis app without them needing to learn finite element theory,” commented Romain Haettel, Principal Engineer of ABB Corporate Research Center (ABB CRC). “We have also been using the COMSOL Server license to distribute our app to colleagues worldwide for testing. With this new version we can hopefully bring an even better user experience through quick launch from our own styled version of the COMSOL Server software.” ABB is a global leader in manufacturing of power transformers and innovator in creating and deploying simulation apps for worldwide use. “Our customers have come to trust the exceptional robustness and user-friendliness of our multiphysics solutions for app creation and deployment. They’re reaping the benefits of such technology by implementing more efficient workflows and processes,” concludes Littmarck.

Hundreds of User-Driven Features and Enhancements to COMSOL Multiphysics, COMSOL Server, and Add-On Products

Administrators can customize the visual theme of the COMSOL Server web interface. Colors, logos, and log in screen can be customized and HTML code added for branding purposes.

Version 5.2a delivers user-driven, new and enhanced functionality from core technology to specialized boundary conditions and material libraries. For example, the tetrahedral meshing algorithm with an included state-of-the-art quality optimization algorithm has made it easier than ever to create coarse meshes used for the preliminary study of complicated CAD geometries that feature many thin parts. Visualizations now include annotations with LaTeX formatting, improved table surface plots, VTK export, and new color tables. 

Magnetic vector hysteresis for the modelling of transformers and ferromagnetic material is introduced. Domain terminal boundary conditions for easier simulation of touch screens and MEMS devices are now available. Ray tracing simulations can combine graded index and constant index materials in meshed and unmeshed domains. The new Optical Aberration plot type is dedicated to measuring monochromatic aberrations. Two-port-networks, fast-frequency sweeps, and non-linear frequency-mixing are available for high-frequency electromagnetics analysis.

COMSOL numerical simulation of a wetted transient time-of-flight ultrasound flow meter. Ultrasound signal propagating in the device is shown at different time steps. The steady-state background flow in the flow meter is computed first. The Convected Wave Equation, Time Explicit physics interface is then used to model the ultrasound signal propagating in the device. The interface is based on the discontinuous Galerkin method (DG).

Design and manufacturing engineers working across all industries will benefit from the new adhesion and de-cohesion feature as they analyse various processes involving mechanical contact with parts sticking together and pulling apart. A new physics interface for modelling linear and non-linear magnetostriction is also available. Heat transfer users can now access a meteorological database from 6000 weather stations and model fluid, solid, or porous media thin structures.

Users modelling fluid flow with buoyancy will appreciate the new gravity property for density variations, which simplifies the set up of natural convection applications where density may vary depending on temperature, salinity, or other variables. Pipe flow simulations can now benefit from the advanced pump curves. For chemical simulations, surface reaction in reactive pellet beds and a new reacting flow multiphysics interface are available. Battery manufacturers and designers can now model complex 3D assemblies in battery packs using the new single particle battery interface. Discharge and recharge behaviours are supplied by the single particle model at every point in the geometry. This makes it possible to estimate the geometrical current density distribution and the local state of charge in the battery pack.

Highlights of New Features and Tools Available in Version 5.2a
  • COMSOL Multiphysics, Application Builder, and COMSOL Server: The appearance of the user interface of simulation apps can change during run time. Centralized unit handling to better serve teams working across different countries is supported. Hyperlinks and videos can now be included. A new Add Multiphysics window makes it easier for users to create multiphysics models incrementally by providing a list of available predefined multiphysics couplings for the selected physics interfaces. Autocomplete has been expanded to many fields including the equation view fields.
  • Geometry and Mesh: The enhanced tetrahedral meshing algorithm can now easily create coarse meshes for complicated CAD geometries that feature many thin parts. A new optimization algorithm built into the mesher is available for improving element quality, which may improve the accuracy of a solution and make it faster to converge. Interactive drawing for 2D geometries now features better coordinate display and snapping points.
  • Mathematical Modelling Tools, Studies, and Visualization: Three new solvers are introduced: the smoothed aggregation algebraic multigrid method (SA-AMG), the domain decomposition solver, and the discontinuous Galerkin (DG) method. Users can now save data and plots added to the Export node under Results in VTK format, making it possible to import COMSOL simulation results and meshes to 3rd party software.
  • Electrical: The AC/DC Module now features a material model for magnetic hysteresis built-in called Jiles-Atherton. The new lumped two-port network coupling is introduced in the RF Module, allowing for lumped modelling to represent parts of a microwave circuit in a simplified way without having to model the details.
  • Mechanical: The Structural Mechanics Module includes the new adhesion and de-cohesion features, available as a subnode under the Contact feature. A Magnetostriction physics interface that supports both linear and nonlinear magnetostriction is now available. The nonlinear material modelling capabilities have been expanded with new plasticity models, mixed isotropic and kinematic hardening, and large-strain viscoelasticity.
  • Fluid: The CFD Module and Heat Transfer Module now include a feature that adds a gravity force and concurrently compensates for the hydrostatic pressure on boundaries. A new linearized density option in Non-Isothermal Flow, a common simplification for natural convection flows, is now available.
  • Chemical: Battery manufacturers and designers can now model complex 3D assemblies in battery packs using the Single Particle Battery physic interface available in the Batteries & Fuel Cells Module. Additionally, a new Reacting Flow Multiphysics physics interface is now available.
Using COMSOL Multiphysics, Application Builder, and COMSOL Server, simulation specialists have access to a fully integrated software environment to create applications that will best serve their specific industry in a dynamic, easy to use, quick to implement format that can be scaled for global benefit.

Availability

To watch the release highlights video and download COMSOL Multiphysics and COMSOL Server software version 5.2a , visit www.comsol.com/release/5.2a

About COMSOL

COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics product is an integrated software environment for creating physics-based models and simulation apps. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electrical, mechanical, fluid flow, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics simulations with all major technical computing and CAD tools on the CAE market. Simulation experts rely on the COMSOL Server product to deploy apps to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL employs more than 400 people in 22 offices worldwide and extends its reach with a network of distributors. For more information, visit www.comsol.com.

Monday, May 16, 2016

ANSYS 17.1 Expands System Simulation, Immersive Multiphysics

PITTSBURGH, USA, May 16, 2016 - Engineers can optimize system performance for next-generation products quicker and easier with the newly released ANSYS 17.1. Building upon the 10x improvements in performance and productivity delivered in ANSYS 17.0, engineers can tap into new system-wide simulation capabilities to optimize system performance early on in the design process thanks to enhancements made across ANSYS’ core solutions. Using simulation early in the product design cycle enables organizations to reduce product time-to-market by 9x, minimize cost by 4x and maximize quality by correcting any design flaws early in the design phase. 17.1 takes another big step forward towards ANSYS vision of full virtual prototype.

Model, Simulate and Analyze Virtual System Prototypes with System Simulation

As products become more complex, the ability to simulate entire systems - including mechanical, electronics, and software - provides a significant advantage. This enables engineers to optimize for the individual components as well as for the combined behaviour in the full system. With ANSYS 17.1 engineers can quickly create physics-based component models and embedded software designs for complete virtual prototypes of multi-domain systems. ANSYS 17.1 provides detailed physics models in combination with embedded software and complex behavioural models of components to perform complete product evaluation early in the design process – enabling organizations to accurately predict how a product will perform in real world conditions. By identifying potential issues early in the development process before design choices are solidified, costly late-state changes can be avoided.

ANSYS AIM Redefines Ease of Use and Intuitive Simulation with New and Extended Physics

More engineers than ever before can now reap the benefits of the markets best and most trusted simulation technology using the latest version of ANSYS AIM. Built for design engineers, AIM is an integrated, easy-to-use simulation environment based on proven ANSYS solver technology. In addition to newly extended structural and fluid flow simulation capabilities, ANSYS AIM now provides product designers with magneto-statics and coupled magnetic-thermal-structural analysis to rapidly design innovative electromechanical products. New polymer extrusion simulation enables designers to identify manufacturing issues early on and reduce tooling lead time. ANSYS 17.1 boosts the customization and automation capabilities of AIM by introducing multi-step custom templates that allow accurate and repeatable simulation methods to be codified and deployed during early stages of product design – reducing product development time and cost.

Enhancements Across All Engineering Disciplines

In addition to the advancements in system simulation and multiphysics, engineers can take advantage of several new enhancements ANSYS 17.1 delivers across the entire portfolio and ANSYS Workbench platform. ANSYS’ electronic technology for antenna and wireless modelling empowers engineers with extended models and design flow automation – enabling organizations to meet the growing demands of the Internet of Things and wireless device markets.

Designing and routing cable structures to meet electromagnetic compatibility standards and packaging requirements in large automotive or aeronautical systems has become increasingly complex and make traditional design rules obsolete. The ANSYS 17.1 electronics suite is equipped with new innovations to efficiently analyze signal integrity through complex cable paths.

In the fluids suite, engineers can prepare large and complex models – from aerospace to under-hood simulations easier thanks to the new fully integrated toolset to navigate, display and manage large computer-aided design datasets. Also new to the fluids suite is cyclic and polar plots that display the results of a transient row analysis, making it easier for users to understand and communicate transient periodic behavior, commonly found in turbomachinery simulations due to blade row interaction.

Building upon the solutions for simulating large fabricated structures, the ANSYS mechanical suite offers new beam-to-solid and shell-to-solid sub-modelling. Now structural engineers can easily convert lower dimensional models used in early design stages to high fidelity 3-D models for a detailed investigation of critical areas. In addition to the performance enhancements across its product lines, ANSYS 17.1 delivers performance improvements for motion analysis. Systems with large number of contacting and sliding parts, such as chain drives and gear assemblies, solve 10 to 20 times faster using new innovations in time stepping schemes and the implementation of mesh based contact detection.

ANSYS semiconductor process technologies have kept in-step with new advancements to enable customers to innovate mobile, computing, networking and IoT applications. Overall simulation runtime performance has been improved by up to 30 percent with a 2x reduction in memory footprint by harnessing distributed machine processing technology for transistor-level analog and mixed signal designs including memory. ANSYS also now supports thermally aware electromigration analysis, enabling users to design with FinFET transistor technology. To further improve low-power chip design, ANSYS 17.1 delivers faster power analysis, better accuracy and greater reduction of power, enabling customers to deliver smaller, higher-power density devices to market faster.

For more details about the release, please visit click here. Current customers can now download ANSYS 17.1 from the Download Center on the ANSYS customer portal.

About ANSYS, Inc.

ANSYS is the global leader in engineering simulation. We bring clarity and insight to our customer's most complex design challenges through the broadest portfolio of fast, accurate and reliable simulation tools. Our technology enables organizations in all industries to imagine high-quality, innovative product designs that are sustainable and have an accelerated time to market. Founded in 1970, ANSYS employs almost 3000 professionals, more than 700 of them with PhDs in engineering fields such as finite element analysis, computational fluid dynamics, electronics and electromagnetics, embedded software, system simulation and design optimization. Headquartered south of Pittsburgh, PA,  U.S.A., ANSYS has more than 75 strategic sales and development locations throughout the world with a network of channel partners in 40+ countries. For more information, visit www.ansys.com.

ANSYS also has a strong presence on the major social channels. To join the simulation conversation, visit: www.ansys.com/Social@ANSYS.

Tuesday, May 10, 2016

COMSOL News 2016 Multiphysics Simulation Online Magazine Available

BURLINGTON, MA, USA, May 10, 2016 - COMSOL, Inc. has published the latest edition of COMSOL News, the company’s annual multiphysics journal reporting on its customers innovative applications. The 2016 edition focuses on simulation specialists bringing multiphysics to everyone so companies can easily develop, clearly communicate and readily distribute designs across teams and client bases.

COMSOL News 2016 reports on how custom applications built using the COMSOL Multiphysics software allow cross-team collaboration; and how the COMSOL Server product enables the distribution of these applications for colleagues and customers to use. Industry experts explain how they harness COMSOL software to create detailed physics-based models and deliver on innovative product development and research projects; from designers and engineers at NASA investigating combustion instability in rocket engines, to a research group at the University at Buffalo designing simulation apps for use across a wide variety of industries such as, 3D printing and traffic control.

The latest COMSOL News issue features more than a dozen articles in this year’s 40-page edition, which cover a diverse range of projects. These include pieces on ABB engineers using the COMSOL Multiphysics software to predict and minimize the noise levels in their transformers; students and consultants collaborating to save historic structures and artifacts with the use of simulation apps; and simulation specialists creating virtual testing apps for furniture manufacturers.

Guest editorial is provided by Dr. Carl Meinhart, a professor of Mechanical Engineering at the University of California, Santa Barbara and founder and CEO of Numerical Design, Inc. Dr. Meinhart gives insight into how the COMSOL Multiphysics software is used in both academia and industry to solve complex multidisciplinary problems. “The reason is simple: What would previously require a custom numerical algorithm, from advanced multiphysics applications to optimization analysis, can be easily solved by COMSOL software,” he said. “With COMSOL, we are able to quickly simulate and analyse many design concepts, and optimize the designs, before committing to actual hardware fabrication.”

COMSOL News 2016 highlights the innovative work done by COMSOL software users including a computational app for testing new oil spill cleanup techniques using hydrophobic meshes and research into man made stars at the MIT Plasma Science and Fusion Center using numerical simulations to evaluate and optimize the proposed design of a compact nuclear fusion machine.

Availability

COMSOL News 2016 is available as an online magazine and can be viewed digitally or downloaded in PDF format at, www.comsol.com/offers/comsol-news-2016.

About COMSOL

COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics product is an integrated software environment for creating physics-based models and simulation apps. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electrical, mechanical, fluid flow, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics simulations with all major technical computing and CAD tools on the CAE market. Simulation experts rely on the COMSOL Server product to deploy apps to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL employs more than 400 people in 22 offices worldwide and extends its reach with a network of distributors. For more information, visit https://www.comsol.com.

Tuesday, April 12, 2016

MSC, Ingeciber SA Release CivilFEM 2016 with Marc

MADRID, Spain, Apr 12, 2016 - MSC Software Corporation and Ingeciber S.A., a specialized civil engineering CAE company with more than 30 years of experience in civil engineering announced the new release of CivilFEM 2016, powered by Marc.

CivilFEM 2016 is a unique simulation solution that provides sophisticated system-level structural simulations of large singular buildings, bridges, tunnels, nuclear power plants, and other structures. "Nonlinear analyses are becoming more frequent in civil engineering and CivilFEM 2016 provides the structural engineer with the ability to solve more nonlinear complex analyses in a simple and comprehensible way," said Miguel Angel Moreno, CEO of Ingeciber.

The new release uses a completely revamped graphics engine, the performance has been improved greatly, and new interface features have been added: new selection filters, separated and selectable geometry and structural element views, grid improvements, drag and drop selection boxes, improved visualization of loads and masses, to name a few.

A powerful grouping system has been implemented allowing the creation of entity groups that grants the organization of the model in higher level entities for fast selection and group operation.

Several new pre-processing capabilities have been included such as the ability to reverse mesh element orientation, direct node interaction allowing the engineer to apply loads and masses on nodes, new cable, springs and connection modeling, among others.

The meshing process has been optimized providing a 50% speed improvement, giving a more fluid interaction with the model.

Several advanced features have been added, such as the Cam-Clay soil model, new Python commands for node interaction and post processing, and a segment to segment contact algorithm. The combination of these features is unique to CivilFEM, making it the state-of-the-art solution for Civil Engineering. For more information, click here (pdf).

CivilFEM 2016, powered by MSC Software's Marc nonlinear FEA solution, is available exclusively from Ingeciber and its distributors worldwide. For more details about the new release, please visit click here.

About Ingeciber S.A.

Ingeciber is a CAE specialized company developer of CivilFEM and supplier of simulation software from international global leaders and related services like technical training, support and consulting. As a pioneer CAE company Ingeciber technologies are used by a wide range of worldwide companies, academic and professionals. For more information visit, www.civilfem.com and www.ingeciber.com.

About MSC Software

MSC Software is one of the ten original software companies and a global leader in helping product manufacturers to advance their engineering methods with simulation software and services. As a trusted partner, MSC Software helps companies improve quality, save time, and reduce costs associated with design and test of manufactured products. Academic institutions, researchers, and students employ MSC's technology to expand individual knowledge as well as expand the horizon of simulation. MSC Software employs 1,100 professionals in 20 countries. For more information about MSC Software's products and services, visit www.mscsoftware.com.

See Also

Jun 25 - MSC, Ingeciber SA Release CivilFEM 2015 with Marc

Friday, February 19, 2016

COMSOL Conference 2015 User Presentations Available

BURLINGTON, MA, USA, Feb 19, 2016 - COMSOL Conference 2015, the largest event for multiphysics simulation, brought together thousands of engineers, researchers, and designers worldwide to share how the COMSOL Multiphysics software and its Application Builder are being used in multiphysics simulation and custom application design around the world. Experts produced over 750 user-contributed papers, posters, and presentations highlighting R&D projects and best practices in electrical, mechanical, fluid, and chemical engineering. The presentations are available at www.comsol.com/2015-user-presentations.

Best Paper and Best Poster Awards

The impressive R&D and application development work of COMSOL Conference 2015 presenters was recognized with Best Paper and Best Poster awards, including:

BOSTON: Best Paper Awards
  • “Structural Analysis of the Advanced Divertor eXperiment's Propposed Vacuum Vessel,” by J. Doody, R. Vieira, B. LaBombard, R. Leccacorvi, J. Irby, R. Granetz, Plasma Science and Fusion Center, Massachusetts Institute of Technology.
  • “Modeling of a Multilayered Propellant Extrusion in Concentric Cylinders,” by S. Durand, C. Dubois, and P. Lafleur, École Polytechnique de Montréal , V. Panchal, D. Park, US Army ARDEC, P. Paradis and D. Lepage, General Dynamics OTS Canada.
  • “Numerical Modeling of 3D Electrowetting Droplet Actuation and Cooling of a Hotspot,” by M. M. Nahar, H. Moon, G. S. Bindiganavane , J. Nikapitiya, Department of Mechanical and Aerospace Engineering, University of Texas at Arlington.
BOSTON: Best Poster Awards
  • “PA Loudspeaker System Design Using Multiphysics Simulation,” by R. Balistreri, QSC Audio Products LLC
  • “Assessment of Squeeze-off Location for Small Diameter Polyethylene (PE) Pipe and Tubing,” by O. Lever and E. Lever, Gas Technology Institute, Energy Delivery & Utilization
  • “Computer Simulation of Microwave Heating of Initially Frozen Sandwiches Using COMSOL Multiphysics® Application Builder,” by D. Fu, Tyson Foods, L. Wang, Simulprocess, J. Liao, S. Dus, K. Bearson, Tyson Foods.
  • “Remote Sensing of Electromagnetically Penetrable Objects: Landmine and IED Detection,” by R. Eze, City University of New York, LaGuardia Community College, G. Sivulka, Regis High School (chosen by popular vote during the conference).
Award-winning user presentations from Boston, USA; Grenoble, France; Pune, India; and Beijing, China are available at here. 

COMSOL Conference 2016 Dates & Locations

Save the date for the COMSOL Conference 2016. It will make multiple stops:
  • Boston, USA: October 7-9
  • Munich, Germany: October 12-14
  • Bangalore, India: October 20-21
  • Curitiba, Brazil: October 20-21
  • Shanghai, China: to be announced
  • Taipei, Taiwan:November 11
  • Seoul, South Korea: November 25
  • Tokyo, Japan: December 9
About COMSOL

COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics product is an integrated software environment for creating physics-based models and simulation apps. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electrical, mechanical, fluid flow, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics simulations with all major technical computing and CAD tools on the CAE market. Simulation experts rely on the COMSOL Server product to deploy apps to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL employs more than 400 people in 22 offices worldwide and extends its reach with a network of distributors. For more information, visit www.comsol.com.

Thursday, February 18, 2016

Altair Gets Geely Best Partner Award for 2015

TROY, MI, USA, Feb 18, 2016 - Altair, a leading global provider of simulation technology and engineering services that empower client innovation and decision-making, announced that Geely Automobile Research Institute Virtual Performance Development Department has awarded Altair as “Best Partner” in 2015. This is the first year that Geely Automobile Research Institute has established a supplier recognition program, and Altair is the only simulation software vendor to receive the award.

Chief Engineer of Geely Automobile Research Institute: Dr. Zhu Ling (Left) and Ms. Meng Yongxin (right) Award Altair representative with Best Partner 2015 award.

In the past year, Altair and Geely launched a comprehensive and close cooperation, including the integration of Altair’s computer aided engineering (CAE) and high performance computing (HPC) software platforms and joint product development projects for its new car models. Altair’s engineering services division, Altair Product Design has been especially involved with the noise, vibration and harshness (NVH) performance of the company’s new vehicles. Collaborating with the Testing Department, the team has carried out simulation studies on components and systems, including vehicle bodies and chassis, all the way up to the whole vehicle utilizing the NVH Director, Altair’s fully integrated NVH solution. The results of the partnership have significantly enhanced NVH performance levels, which has been unanimously praised by Geely.

“It is the year for rapid development on R&D and a crucial year for CAE business transformation for Geely in 2015,” said Dr. Zhu Ling, Chief Engineer of Geely Automobile Research Institute Virtual Performance Development Department. “Altair has provided Geely a complete CAE solution for many years, and the global technical team of Altair Product Design has supported Geely’s CAE business development strongly. We have formed a strategic win-win cooperative relationship, and we wish to cooperate more in the future.” 

"We are honored to receive the ‘Best Partner’ award from Geely. We have kept a strong technical relationship in the past few years involving the performance enhancement of new models with projects in crash, NVH, fatigue, design optimization, chassis design, and more," said Mr. Liu Zhiqiang, Sales Director of Altair China's automotive industry. “Today, China is vigorously promoting the development of independent brands. As one of the most trusted partners in the automotive industry, we not only provide powerful software platform to automotive OEMs, but also introduce advanced vehicle development experience to domestic R&D projects utilizing our global consulting team." 

About Geely

Founded in 1986, Zhejiang Geely Holding Group (here in after referred to as “Geely”) began to specialize in the automobile industry in 1997. Geely quickly focused on the industry, technological innovation, and personnel training over the past years. With total assets of more than RMB 100 billion, Geely is one of the China’s top 500 companies for ten consecutive years, ranks in the top 10 automobile manufacturers for eight consecutive years. For more information, visit www.geely.com. 

About Altair

A ltair is focused on the development and broad application of simulation technology to synthesize and optimize designs, processes and decisions for improved business performance. Privately held with more than 2,600 employees, Altair is headquartered in Troy, Michigan, USA and operates more than 45 offices throughout 24 countries. Today, Altair serves more than 5,000 corporate clients across broad industry segments. For more information, visit www.altair.com.

Wednesday, February 3, 2016

COMSOL Offers LiveLink for SOLIDWORKS Add-on

BURLINGTON, MA, USA, Feb 3, 2016 - COMSOL, the leading provider of multiphysics modeling, simulation, and application design software, has announced support for app development in the latest version of LiveLink for SOLIDWORKS. Part of COMSOL Multiphysics software, the only fully integrated environment for creating custom simulation applications, LiveLink for SOLIDWORKS connects COMSOL software simulations and 3D design and its latest version allows users to build apps with the Application Builder. This provides design engineers with a better understanding of how SOLIDWORKS software designs perform in the intended operating environment by delivering an accurate evaluation of the impact of any physical effects and their interactions. With LiveLink for SOLIDWORKS and the Application Builder, engineers can build apps based on COMSOL models created from a SOLIDWORKS software geometry. LiveLink for SOLIDWORKS allows them to import and perform operations on their CAD geometries from within an app and then synchronize the final geometry with SOLIDWORKS software.

LiveLink for SOLIDWORKS includes a One Window interface where SOLIDWORKS software users can stay inside its environment and perform their multiphysics analysis directly from it

LiveLink for the SOLIDWORKS includes a One Window interface where SOLIDWORKS software users can stay inside its environment and perform their multiphysics analysis directly from it.

LiveLink for SOLIDWORKS includes a bidirectional interface between the COMSOL Desktop environment and SOLIDWORKS software. This allows synchronization of the CAD design with the COMSOL model; it also lets the simulation control the CAD design parameters in the SOLIDWORKS software file. For even closer integration, the One Window interface makes the familiar windows, tools, icons, and menu items from COMSOL Multiphysics available within the SOLIDWORKS software user interface, enabling users to set up simulations without leaving the CAD design environment.

LiveLink for SOLIDWORKS also supports user-defined selections for an easier and more efficient simulation set-up on the synchronized CAD design. In SOLIDWORKS software, the user can define selections, including bodies, faces, edges, or points, that are synchronized to the COMSOL model where they are available to assign materials, physics settings, or any other model definitions. Users can also create selections from features of the Feature Manager Design Tree in SOLIDWORKS software, or from the components of the CAD assembly. In addition, LiveLink for SOLIDWORKS can automatically generate and synchronize selections based on the material assignments in the CAD design in SOLIDWORKS software.

With the LiveLink for SOLIDWORKS add-on product, users can take full advantage of the Application Builder available in the COMSOL Multiphysics software. The latest release, COMSOL Multiphysics version 5.2, provides simulations experts with cutting edge capabilities for simulation app design. The software integrates highly productive model building, app design, and deployment tools that allow simulation applications to be easily run by users anywhere. About 50 new app examples are included in the extensive Application Libraries, including membrane dialysis, water treatment, thermoelectric cooling, heat exchangers, touchscreen design, magnetic prospecting, piezoacoustic transducers, muffler design, MEMS sensors, pressure vessels, and more.

About COMSOL

COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics product is an integrated software environment for creating physics-based models and simulation apps. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electrical, mechanical, fluid flow, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics simulations with all major technical computing and CAD tools on the CAE market. Simulation experts rely on the COMSOL Server product to deploy apps to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL employs more than 400 people in 22 offices worldwide and extends its reach with a network of distributors. For more information, visit www.comsol.com.

Saturday, January 30, 2016

ANSYS 17.0 Released

PITTSBURGH, PA, USA, Jan 30, 2016 - Engineers across disciplines – from structures to fluids to electromagnetics to systems – will realize step-change improvements in the way they develop products using the newly released ANSYS 17.0. This next generation of ANSYS (NASDAQ: ANSS) industry-leading engineering simulation solutions set the scene for the next quantum leaps in product development, enabling unprecedented advancements across an array of industry initiatives from smart devices to autonomous vehicles to more energy-efficient machines. The most feature-rich release in the company's 45-year history, available now, delivers 10x improvements to product development productivity, insight and performance.


Simulation has been identified as one of the key pillars of the next industrial revolution, known as Industry 4.0. With the advent of the Internet of Things all products are getting smarter, new advanced materials are enabling lighter, stronger and more sustainable designs, and additive manufacturing enables users to 3-D print anything they can imagine. Unlocking the power of these trends is impossible without simulation tools' ability to virtually explore these vastly increased options to arrive at the winning designs of tomorrow.

"Companies are under relentless pressure to create top-line growth and increase savings," said Jim Cashman, president and CEO of ANSYS. "Innovation, time to market, operational efficiency and product quality are key factors that contribute to this business success. ANSYS is focused on helping customers improve their critical business metrics and leapfrog the competition by improving their product development process through engineering simulation. When we set out to develop the next release of our simulation platform, we challenged ourselves to improve our customers' product development process by a full order of magnitude, or 10x." 

"Hyperloop Technology is accomplishing safe and reliable ground transportation at close to the speed of sound," said Josh Giegel, vice president of design and analysis, Hyperloop Technologies. "ANSYS 17.0 technology offers deeper insight into our designs and enables us to make the necessary improvement to our development process, which in turn will help us realize the Hyperloop concept."

"ANSYS has been an acknowledged leader in enabling simulation-driven design over the past several decades, and ANSYS 17.0 release is a major step forward in terms of bringing together all of the ANSYS modeling and simulation capabilities required to achieve the vision of an integrated yet open enterprise product innovation platform driven by behavior modeling and simulation," said Peter Bilello, president of CIMdata. "As industry moves ahead over the next decade to realize the vision and promised benefits of Model-Based Systems Engineering in the context of mega-trends such as the Internet of Things (IoT), Industry 4.0 and the Circular Economy, ANSYS' product portfolio and M&S platform is well positioned to meet the multi-domain requirements for developing complex cyber-physical systems with ever increasing levels of software and electronics content."

Highlights of the release include:

10x Improvements to Productivity - ANSYS 17.0 delivers solutions faster so engineers and designers can make more informed decisions sooner in the product development cycle. That enables organizations to rapidly innovate and bring products to market faster, while getting more productivity from their existing engineering assets.

Through tighter integration of semiconductor and electronics simulation solutions, ANSYS 17.0 delivers a comprehensive chip-package-system design workflow. New capabilities for automated thermal analysis and integrated structural analysis deliver an unequalled chip-aware and system-aware simulation solution, enabling customers to deliver smaller, higher-power density devices to market faster. With the advent of the Internet of Things, more products and engineers will rely on these capabilities.

In the fluids suite, ANSYS continues its technology leadership with breakthrough advancements in physics modeling and introduces new innovations across the entire workflow and user environment design to accelerate time to results by up to 85 percent without compromising accuracy. Improvements to workflow and meshing enable novice users to quickly become productive while new tools and options expand the application reach for experienced users.

"ANSYS has broken through by truly integrating multi-domain 3-D meshed solutions," said Brad Kramer, director of engineering at HUSCO International. "By closely integrating the fluid and the mechanical interfaces, we are now able to simulate and gain insight into the real physics of the problem without having to set up artificial boundary conditions."

Preprocessing – or the act of setting up simulations – with ANSYS 17.0 has also improved by an order of magnitude. Using the direct modeling tools in ANSYS 17.0, users can prepare their geometry for analysis faster than traditional computer-aided design (CAD). Save and load times for complex models, as well as the performance for common geometry editing functions has increased by up to 100 times. ANSYS 17.0 geometry tools also boast tighter integration to ANSYS Workbench and offer many productivity advancements for modeling fabricated and composite structures. Fluids pre-processing for complex systems has also improved dramatically. The process of preparing and meshing models with hundreds of parts has been reduced from days to hours with ANSYS 17.0. 

ANSYS 17.0 enables software engineers to be more productive with developing, testing and certifying embedded software. New industry-specific vertical solutions take full benefit from the openness and flexibility of the platform to facilitate interactions with original equipment manufacturers and suppliers while adhering to such industry standards as ARINC 661/664, FACE and AUTOSAR.

10x Improvements for Deeper Insight - ANSYS 17.0 delivers deeper insight into real-world product performance through such enhancements as higher fidelity simulations and better post processing. For example, with printed circuit boards, engineers can now quickly import ECAD geometry and perform coupled thermal-structural analysis with power integrity and electronics cooling analyses to accurately predict stress, deformation and fatigue. These capabilities enable engineers to design board layouts and thermal management strategies for more reliable electronic components. As a result, complex board and packages can be set up and solved in minutes, not hours or days.

As products become more complex, the ability to simulate entire systems provides a significant advantage to manufacturers. Using a single simulation platform at ANSYS 17.0, engineers can not only simulate physical models but can also consider embedded systems design and embedded software models. This enables virtual systems simulation, testing and prototyping, reducing product development time and cost. In this release, ANSYS introduces native support for the industry-standard system modeling language, Modelica, which enables access to hundreds of additional mechanical and fluid component models in addition to its rich model library for power electronics. At the same time, advancements in the platform provide more insight to real world system performance by enabling high-fidelity 3-D results to be incorporated into system-level models.

ANSYS 17.0 greatly expands turbomachinery simulation capabilities across a broad spectrum to produce highly accurate results, across a wider array of operating conditions and with shorter turnaround time. Engineers can solve considerably more transient blade row configurations by calculating as few as one blade per row instead of the full wheel to speed time to solution by over 10x and drastically reducing the required computing resources. These advances are critical given that turbines produce 99 percent of the world's electricity.

10x Improvements to Performance - ANSYS 17.0 delivers performance improvements for all of its product lines, particularly in the realm of high-performance computing (HPC). ANSYS 17.0 introduces the most modern HPC solver architectures that leverages the latest processor technologies. Organizations can leverage this power on most IT configurations – from desktops to cloud environments – to obtain their simulation results sooner.

There is a clear global demand to develop more power efficient machines, but progress has been hindered due to the huge computational resources required to simulate an electric machine. Complete transient electromagnetic field analysis of an electric machine can require two weeks or more to complete. HPC advances in the ANSYS 17.0 electromagnetics suite deliver unprecedented computational speed for full transient electromagnetic field simulation for electric motor design. Simulations of critical transient behaviors that previously required weeks of computational time can now be completed in hours during early design stages, reducing the risk of project delays and late-stage design changes.

"This is amazing technology," said Briam Cavalca Bork, product engineer at WEG. "ANSYS 17.0 allows us to fully utilize our HPC hardware. Simulation time has improved by a factor of 20x, but more importantly we have gained more in-depth and timely design insight that will allow us to deliver industry leading, innovative machine designs. The new ANSYS technology delivers the capability to do more complex analyses on a greater variety of scenarios."

As previously announced, ANSYS fluids solutions have smashed the previous simulation world record by scaling to 129,000 compute cores running at 90 percent efficiency – a 10x improvement over the past two years. HPC performance of the structures suite has also improved significantly and now demonstrates scaling up to 1000 cores. Structural simulations which required running overnight, can now be completed in an hour, enabling engineers to explore 10x more variations and find the best design faster. 

"Organizations across a wide variety of industries are struggling to keep pace with the growing need for data-intensive modeling and large-scale simulations to accelerate business innovation," said Scott Misage, vice president and general manager, High Performance Computing, Hewlett Packard Enterprise. "By bringing together all high-performance computing (HPC) advances made in the new ANSYS 17 release with our industry-leading HPE Apollo compute platform for HPC and big data workloads, our customers can now transform their product development processes, reduce engineering costs and accelerate time-to-market."

"Our partnership with ANSYS has always equipped us with exceptional simulation capabilities, which have allowed us to design and develop our cars more quickly, efficiently and intelligently," said Nathan Sykes, head of numerical tools and technologies, Red Bull Racing and Technology. "The ANSYS 17.0 fluids suite has been used extensively in the design of our 2016 challenger, the RB12, allowing us to conduct critical CFD analysis and make design decisions faster than ever before."

For more information on ANSYS 17.0, click ansys.com/17.

About ANSYS, Inc.

ANSYS is the global leader in engineering simulation. We bring clarity and insight to our customer's most complex design challenges through the broadest portfolio of fast, accurate and reliable simulation tools. Our technology enables organizations in all industries to imagine high-quality, innovative product designs that are sustainable and have an accelerated time to market. Founded in 1970, ANSYS employs almost 3000 professionals, more than 700 of them with PhDs in engineering fields such as finite element analysis, computational fluid dynamics, electronics and electromagnetics, embedded software, system simulation and design optimization. Headquartered south of Pittsburgh, U.S.A., ANSYS has more than 75 strategic sales and development locations throughout the world with a network of channel partners in 40+ countries. For more information, visit www.ansys.com.

Sunday, January 10, 2016

COMSOL Multiphysics Available on Rescale Cloud

BURLINGTON, MA, USA, Jan 10, 2016 - COMSOL is excited to announce the availability of COMSOL Multiphysics software on Rescale simulation platforms through a collaboration with COMSOL, creators of the robust, physics-based modeling and simulation software.

COMSOL Multiphysics is an all-inclusive modeling software, based on powerful numerical methods, for simulating physics-based problems. With COMSOL Multiphysics, users are able to account for coupled or multiphysics phenomena. The simulation suite is further expandable with more than 30 add-on products for simulating electrical, mechanical, fluid flow, and chemical applications allowing for unlimited multiphysics combinations.

Simulation experts can use the Application Builder within COMSOL Multiphysics to create specialized simulation apps that can be run by engineers and others not well versed in simulation. These apps are hosted and run on the COMSOL Server™ software, which is also available on Rescale’s cloud.

Now COMSOL Multiphysics users can run computationally demanding analyses on high-end hardware that matches the power and flexibility of their solvers. Users submit simulations using their existing COMSOL Multiphysics licenses with on-demand high performance computing (HPC) hardware, making use of the software’s automatic and sophisticated parallel processing capabilities. The new Rescale and COMSOL collaboration allows users to accelerate their COMSOL Multiphysics analyses using Rescale’s diverse and dynamic pay-per-use HPC platforms, leveraging built-in administration and collaboration tools designed to improve and speed-up the simulation process.

"For customers seeking HPC resources for bigger analyses, this important initiative with Rescale allows our users to take full advantage of both the COMSOL Multiphysics software and Rescale's secure and flexible simulation environments," says Phil Kinnane, COMSOL's VP of Business Development.

“We’re very excited to be partnering with COMSOL to offer their unique software on our platforms. COMSOL Multiphysics is a critical tool for many engineers and scientists worldwide and an excellent addition to our suite of available software packages” said Vice President of Sales, Tony Spagnuolo.

For users interested in taking advantage of COMSOL Multiphysics in the cloud using Rescale’s platforms, you can contact Rescale and COMSOL using the resources below. To begin running COMSOL Multiphysics immediately, you can create a free Rescale account by going to www.rescale.com/signup.

About COMSOL

COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics® product is an integrated software environment for creating physics-based models and simulation apps. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electrical, mechanical, fluid flow, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics simulations with all major technical computing and CAD tools on the CAE market. Simulation experts rely on the COMSOL Server™ product to deploy apps to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL employs more than 400 people in 22 offices worldwide and extends its reach with a network of distributors. For more information, visit www.comsol.com/contact.

About Rescale

Rescale is the world’s leading cloud platform provider of simulation software and high performance computing (HPC) solutions. Rescale’s platform solutions are deployed securely and seamlessly to enterprises via a web-based application environment powered by preeminent simulation software providers and backed by the largest commercially available HPC infrastructure. Headquartered in San Francisco, CA, Rescale’s customers include global Fortune 500 companies in the aerospace, automotive, life sciences, marine, consumer products, and energy sectors. For more information, visit www.rescale.com