COMSOL Days Schedule for 2017 Announced

BURLINGTON, MA, USA, Jan 15, 2017 - COMSOL, Inc. the leading provider of software solutions for multiphysics modelling and simulation, announced the COMSOL Days schedule for 2017. The COMSOL Day events are open to anyone who wants to advance their multiphysics modelling skills and learn how to build custom simulation apps. The day will consist of training, talks by invited speakers, and the opportunity to connect with the COMSOL community.

“Our mission is to expand access to numerical simulation to engineers without previous experience using multiphysics software. To achieve this goal, we released the Application Builder tool for COMSOL Multiphysics for creating custom apps and COMSOL Server license for deployment and access through a web browser or a client,” comments Jeff Hiller, VP of Sales, COMSOL, Inc. “COMSOL Days directly support that mission by bringing new and existing users together for a daylong event consisting of training, invited talks, and countless opportunities to exchange ideas with peers and application specialists from COMSOL.”

There are COMSOL Days scheduled around the globe in major cities such as Bethesda, MD; Cambridge, MA; Detroit, MI; Toronto, ON; Paris, France; Brescia, Italy. For the full list of cities and for more details about COMSOL Days and to register and attend, visit www.comsol.com/comsol-days.

About COMSOL

COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics product is an integrated software environment for creating physics-based models and simulation apps. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electrical, mechanical, fluid flow, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics simulations with all major technical computing and CAD tools on the CAE market. Simulation experts rely on the COMSOL Server product to deploy apps to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL employs more than 480 people in 21 offices worldwide and extends its reach with a network of distributors. For  more information, visit www.comsol.com.

COMSOL Issues Multiphysics Simulation 2016 Edition

BURLINGTON, MA, USA, Oct 26, 2016 - COMSOL, Inc. the leading provider of multiphysics modeling, simulation, and application design and deployment software, is excited to announce that the latest edition of Multiphysics Simulation is now available. The 2016 edition features articles on a range of topics, including 5G simulation apps, implantable medical devices, organic LEDs, and high efficiency photonic switches.

“Multiphysics simulation tools are being used across many industries with great success,” comments Bernt Nilsson, Senior VP of Marketing with COMSOL, Inc. “The Multiphysics Simulation magazine is a compilation of a dozen outstanding product and research projects. In every case, numerical simulation has a major impact on the outcome for organizations that are now expanding the use of simulation to much larger groups of users.”

This edition of Multiphysics Simulation shares a number of stories about how simulation experts are communicating their simulation work with colleagues and customers. A few highlights:

• Researchers at GrafTech developed a detailed model of graphite heat spreaders and turned it into a simulation app for their sales team.
• Within Konica Minolta researchers are using multiphysics simulation to increase light output and energy efficiency in organic LED (OLED) systems.
• The team at Huawei is hard at work designing energy efficient photonic switches to support growing network traffic.

Other articles highlight how industry leaders have employed simulation driven product development practices to stay ahead of the competition. Researchers at St. Jude Medical are using multiphysics simulation to enhance the performance and safety of wireless implantable devices for heart disease patients. The team at ArcelorMittal is perfecting the process for laser welding within the automotive industry.

Availability

Multiphysics Simulation 2016 is available as an online magazine and can be viewed digitally or downloaded in PDF format at: https://www.comsol.com/offers/mphsim16.

About COMSOL

COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics product is an integrated software environment for creating physics-based models and simulation apps. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electrical, mechanical, fluid flow, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics simulations with all major technical computing and CAD tools on the CAE market. Simulation experts rely on the COMSOL Server product to deploy apps to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL employs more than 480 people in 21 offices worldwide and extends its reach with a network of distributors. For more information, visit https://www.comsol.com.

Dassault Acquires Germany's CST for 220M Euros

VELIZY-VILLACOUBLAY, France, Oct 8, 2016 - Dassault Systems (Euronext Paris: #13065, DSY.PA), the 3DEXPERIENCE Company, world leader in 3D design software, 3D Digital Mock Up and Product Lifecycle Management (PLM) solutions, announced the completion of the acquisition of CST - Computer Simulation Technology AG, the technology leader in electromagnetic (EM) and electronics simulation based in Germany, for 220 million euros. Dassault Systems will integrate CST solutions into its portfolio of industry solution experiences based on the 3DEXPERIENCE platform to offer a new standard in multiphysics and multiscale simulation. 

CST STUDIO SUITE software is used by designers and engineers at more than 2,000 leading companies in the high-tech, transportation and mobility, aerospace and defense, and energy industries to evaluate all types of EM effects during every stage of electronic system design processes. CST’s customers include Airbus Defence and Space, Bosch Group, Frauscher Sensor Technology and Sirona. 

EM simulation is an essential part of the development of connected products to ensure the performance, reliability and safety of their interactions with their surrounding environment. With the integration of CST, Dassault Systems will offer full spectrum EM simulation of autonomous cars, connected homes, medical equipment, wearable electronics and other smart objects. Customers can quickly create and analyze high fidelity electromagnetic behavioral models that simulate electronic, antenna, electrical device and electro-mechanical product function across all frequencies and length scales, as well as access design synthesis and simulation tools needed for intricate electronic systems design. 

About Dassault Systems

Dassault Systems, the 3DEXPERIENCE Company, provides business and people with virtual universes to imagine sustainable innovations. Its world-leading solutions transform the way products are designed, produced, and supported. Dassault Systems’ collaborative solutions foster social innovation, expanding possibilities for the virtual world to improve the real world. The group brings value to over 210, 000 customers of all sizes, in all industries, in more than 140 countries. For more information, visit www.3ds.com.

COMSOL Offers Rotordynamics Module, Performance Improvements at Boston Conference

BURLINGTON, MA, USA, Oct 8, 2016 - COMSOL, Inc. the leading provider of software solutions for multiphysics modeling, simulation, app design and deployment, provided attendees with the latest updates of COMSOL Multiphysics software, COMSOL Server product, and COMSOL Client at the 12th annual COMSOL Conference Boston. The latest update of the COMSOL software features major performance increases and the release of the Rotordynamics Module, which is now available as an add-on product to the Structural Mechanics Module.

Performance Improvements for the Handling of Large Models

The latest version of COMSOL software provides up to a 10x speedup for the handling of large models and mesh creation. A combination of a tetrahedral and swept mesh of a gas turbine is shown.

The latest update of the COMSOL software provides significant performance improvements compared to versions made available a year ago. The speedup is most notable with respect to the handling of models with several thousand domains and boundaries.

COMSOL is committed to continue its strive to deliver the most efficient and robust multiphysics environment for its wide range of products for electrical, mechanical, acoustics, fluid, thermal, and chemical simulations. “To fulfil this commitment, COMSOL’s development team ensures that each update of the COMSOL software provides more efficient solvers, meshing, and physics modeling functionality”, comments Bjorn Sjodin, VP of Product Management, COMSOL, Inc.

The Future of Simulation: Application Design and Deployment

This app created with COMSOL Multiphysics software allows, the user to evaluate the structural stress in a bike frame for varying dimensions, materials, and loading conditions.

Svante Littmarck, President and CEO, COMSOL, Inc. showcased examples of how customers are leveraging simulation apps to enable company-wide usage of multiphysics simulation. “These case studies provide us with a first look at how our customers benefit from building and deploying simulation apps,” said Littmarck in his keynote presentation, “The Application Builder and COMSOL Server are the tools that organizations need in order to provide multiphysics for everyone.”

The Application Builder has enabled simulation specialists to create multiphysics apps, based on their detailed models, through custom interfaces that can be easily accessed via COMSOL Client or a web browser connecting to a local installation of COMSOL Server.

Custom applications can be created for anyone from technicians, support staff, designers, to customer service representatives, empowering them to make on-the-fly design iterations and report generation.

With COMSOL Server organizations can deploy industry-specific analysis tools in a dynamic, streamlined, quick to implement format that can be scaled for global benefit.

Release of the Rotordynamics Module

Pressure distribution in the lubricant of the bearings (rainbow color plot), von Mises stress (blue color plot), and displacement of the bearings (orbit plot) resulting from a rotordynamics analysis.

The latest update of the COMSOL software product suite includes the new Rotordynamics Module, which will aid engineers in analyzing vibrations due to centrifugal forces and other gyroscopic effects in rotating machinery. This new product will be used to ensure that rotor vibrations are contained within acceptable design limits by providing functionality for evaluating critical speed, whirl, and bearings. This module will be of particular interest to those working with the design of turbines, turbochargers, electrical machinery, and pumps in the automobile, marine, aerospace, energy, and household appliance industries.

“With the Rotordynamics Module, users can take into account the effects of various components such as disks, bearings, and foundations,” explains Prashant Srivastava, a Technical Product Manager at COMSOL. “Users will also be able to easily postprocess their results directly within the software to present the results of their analysis as Campbell diagrams, modal orbits, harmonic orbits, waterfall plots, and whirl plots.”

The new module works in concert with the other COMSOL products. For example, additional tools for modeling geared rotors are available when the Rotordynamics Module is combined with the Multibody Dynamics Module.

Availability

To download the latest version of COMSOL Multiphysics software and COMSOL Server product or update your current installation, visit www.comsol.com/product-update.

COMSOL software products are supported on Windows, Linux, and mac OS. The Application Builder is supported on Windows.

About COMSOL

COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics product is an integrated software environment for creating physics-based models and simulation apps. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electrical, mechanical, fluid flow, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics simulations with all major technical computing and CAD tools on the CAE market. Simulation experts rely on the COMSOL Server product to deploy apps to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL employs more than 480 people in 21 offices worldwide and extends its reach with a network of distributors. For more information, visit www.comsol.com.

COMSOL Announces Keynotes for 2016 Boston Conference

BURLINGTON, MA, USA, Sep 15, 2016 - The organizers of COMSOL Conference 2016 Boston are proud to announce this year’s keynote speakers. The COMSOL Conference is held worldwide in seven major cities. It attracts thousands of engineers and scientists with its focus on multiphysics simulation and application design. The first event is taking place in Boston on October 5-7 and features the following line up of distinguished modelling and simulation professionals:

• Bernard McGarvey, senior engineering advisor at Eli Lilly and Company
• Edward P. Furlani, professor in the Departments of Chemical and Biological Engineering and Electrical Engineering at University at Buffalo (UB) SUNY
• Carl Meinhart, professor of mechanical engineering at the University of California – Santa Barbara (UCSB) and founder and CEO of Numerical Design, Inc.,
• Sebastien Perrier, R&D acoustical engineer at Echologics Engineering

KEYNOTE: Leveraging Modelling and First Principles Thinking to Accelerate Improvement at a Pharmaceutical Company:

Dr. Bernard McGarvey is a senior engineering advisor responsible for process modelling applications at Eli Lilly and Company. He supports the application of process modelling in both manufacturing and process development. He has 32 years of experience in manufacturing, where he has held positions in process engineering, process control engineering, and technical services. His interests include general mathematical modeling and simulation, process data analysis, capacity/workflow modeling, risk management, fluid dynamics, cold chain container design and qualification, nonlinear model estimation, and quality engineering. He has a BEng degree and a PhD from University College Dublin, Ireland.

KEYNOTE: Multiphysics and Multiscale Simulations: Advancing Basic Science and Industrial Applications:

Dr. Edward P. Furlani holds a PhD in theoretical physics and has a joint appointment as a professor in the Departments of Chemical and Biological Engineering and Electrical Engineering at University at Buffalo (UB) SUNY. He transitioned to academia in 2011 from the Eastman Kodak Research Labs, where he performed interdisciplinary modelling for the development of commercial materials and devices. His industrial experience spans applications in the fields of microfluidics, photonics, applied magnetics, and microsystems technology. His current research involves the development of computational models to design innovative nano- and microstructured materials and devices with unique functionality. His current research spans the applications of microfluidics, biosensing, energy storage, nanophotonics, and magnetic particles. Professor Furlani’s research contributions include over 100 peer-reviewed publications, a textbook on applied magnetics, and numerous invited conference presentations. He also has a distinguished record of translational research and currently holds 152 U.S. patents.

KEYNOTE: Transport Processes in Microfluidics:

Dr. Carl Meinhart is a professor of mechanical engineering at the University of California – Santa Barbara (UCSB). He obtained his PhD from the University of Illinois in 1994. Since coming to UCSB in 1996, his research has focused on developing microfluidic devices and investigating their fundamental transport mechanisms. Professor Meinhart’s research on microfluidics has been cited approximately 7,800 times, with an h-index of 34 (Google Scholar™ scholarly texts search). He has seven issued patents. In addition to being a professor at UCSB, Dr. Meinhart is the founder and CEO of Numerical Design, Inc., which is a COMSOL Certified Consultant. Dr. Meinhart is a fellow of the American Physical Society.

KEYNOTE: The Effect of Local Resonators on Sound Propagation in Fluid-Filled Pipes:

Sebastien Perrier is a mechanical engineer who received his PhD from the University of Sherbrooke. He specialized in acoustics and vibrations, coupling of structures, and signal processing. Sebastien has been working with Echologics Engineering for 2 years, applying his expertise to optimize and develop next-generation solutions for buried pipe infrastructure management and leak detection. His work focuses on carrying out laboratory and field tests, developing processes and methods for measuring vibration and pressure events, and pipe modelling.

2016 COMSOL Conference

The COMSOL Conference brings together engineers, researchers, and scientists worldwide throughout seven locations, providing them with the chance to showcase their work, share innovative technologies and best practices, as well as the opportunity to interact with the members of the COMSOL community.

The 2016 conference will feature presentations on simulation apps using the Application Builder and the COMSOL Server product. Other highlights include:

• Over 30 hands-on training opportunities to learn how to use COMSOL Multiphysics software for better R&D and design
• Talks by industry experts on the latest in computational modelling
• Discussion-oriented Focus Sessions covering simulation best practices, moderated by our product managers
• The introduction of the newest simulation tools and technologies
• User-contributed paper and poster presentations
• An exhibition showcasing products offered by COMSOL Certified Consultants, software and hardware providers, and other exhibitors within the CAE industry
• The chance to interact with peers and explore the simulation work of fellow engineers

For more information about COMSOL Boston Conference 2016, click here.

About COMSOL

COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics product is an integrated software environment for creating physics-based models and simulation apps. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electrical, mechanical, fluid flow, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics simulations with all major technical computing and CAD tools on the CAE market. Simulation experts rely on the COMSOL Server product to deploy apps to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL employs more than 460 people in 22 offices worldwide and extends its reach with a network of distributors. For more information, visit www.comsol.com.

COMSOL Multiphysics, Server v5.2a for CAE Released

BURLINGTON, MA, USA, Jun 18, 2016 - COMSOL, Inc. the leading provider of multiphysics modelling, simulation, and application design software, announced the latest release of the COMSOL Multiphysics and COMSOL Server simulation software environment. Hundreds of user-driven features and enhancements to COMSOL Multiphysics, COMSOL Server, and add-on products have been implemented with an emphasis on accuracy, usability, and productivity. From new solvers and methods, to application design and deployment tools, COMSOL software version 5.2a expands the electrical, mechanical, fluid, and chemical design and optimization capabilities.

Powerful New Tools for Multiphysics Simulation

In COMSOL Multiphysics 5.2a, three new solvers deliver faster and more memory efficient computations. The smoothed aggregation algebraic multi-grid (SA-AMG) solver has proven to be particularly efficient for linear elastic analysis, but is also applicable to many other types of analyses. This solver is very memory conservative, making it possible to run structural assemblies with millions of degrees of freedom on a standard desktop or laptop computer.

Thermoviscous acoustics simulation solved with the domain decomposition solver. Local acceleration, total acoustic pressure, and total thermo-viscous power dissipation density are shown. This COMSOL model is used to design microphones and speakers used in consumer products, such as, smartphones, tablets, and laptops. It consists of 2.5 million degrees of freedom and required 14 GB of RAM to solve. Previsously 120 GB were needed using a direct solver.

The domain decomposition solver has been optimized for handling large multiphysics models. “The domain decomposition solver provides simulation specialists with a robust and flexible technology to more efficiently compute strongly-coupled multiphysics applications which previously required a memory-hungry direct solver,” says Jacob Ystrom, Technical Manager of the numerical analysis department at COMSOL. “Using this solver, customers will benefit from improved efficiency when running on single computers, clusters, as well as when combined with other solvers such as the aggregation algebraic multigrid solver.”

A new explicit solver based on the discontinuous Galerkin (DG) method for acoustics in the time-domain is now available. “Combing the discontinuous Galerkin method with the new absorbing layers in the time-domain, results in a level of memory efficiency that will allow our customers to perform more realistic simulations than ever possible before, for a given memory size” says Mads Jensen, Technical Product Manager, Acoustics.

Building and Deploying Apps: Easy and Scalable for Global Use

The complete suite of computational tools provided by COMSOL Multiphysics software and its Application Builder allows simulation specialists to design and optimize their products and create apps for the benefit of colleagues and customers. Simulation apps allow users without any previous experience using simulation software to run the apps for their specific purpose. With version 5.2a, app designers can build even more dynamic apps where the appearance of the user interface can change during run time, centralize unit handling to better serve teams working across different countries, and include hyperlinks and videos.

This app example shipped with the Application Libraries included in COMSOL Multiphysics and COMSOL Server, can be used for the design of a magnetic induction device used for food processing.

Apps can be deployed throughout organizations using the COMSOL Client for Windows or web browser by connecting to a COMSOL Server installation. This provides a cost-effective solution for managing how apps are used, either by users within an organization or to an organization’s clients and customers worldwide. In this latest version, administrators can customize the visual appearance and style of COMSOL Server software for branding purposes, and set the number of pre-launched applications for high-usage cases.

“By providing our customers with the flexibility to customize the visual appearance and style of their COMSOL Server installation, they will be able to provide a cohesive brand experience that their colleagues and customers will be able to easily recognize and adopt into their existing processes,” says Svante Littmarck, President and CEO, COMSOL Inc. 

“The Application Builder allowed us to give other departments access to our analysis app without them needing to learn finite element theory,” commented Romain Haettel, Principal Engineer of ABB Corporate Research Center (ABB CRC). “We have also been using the COMSOL Server license to distribute our app to colleagues worldwide for testing. With this new version we can hopefully bring an even better user experience through quick launch from our own styled version of the COMSOL Server software.” ABB is a global leader in manufacturing of power transformers and innovator in creating and deploying simulation apps for worldwide use. “Our customers have come to trust the exceptional robustness and user-friendliness of our multiphysics solutions for app creation and deployment. They’re reaping the benefits of such technology by implementing more efficient workflows and processes,” concludes Littmarck.

Hundreds of User-Driven Features and Enhancements to COMSOL Multiphysics, COMSOL Server, and Add-On Products

Administrators can customize the visual theme of the COMSOL Server web interface. Colors, logos, and log in screen can be customized and HTML code added for branding purposes.

Version 5.2a delivers user-driven, new and enhanced functionality from core technology to specialized boundary conditions and material libraries. For example, the tetrahedral meshing algorithm with an included state-of-the-art quality optimization algorithm has made it easier than ever to create coarse meshes used for the preliminary study of complicated CAD geometries that feature many thin parts. Visualizations now include annotations with LaTeX formatting, improved table surface plots, VTK export, and new color tables. 

Magnetic vector hysteresis for the modelling of transformers and ferromagnetic material is introduced. Domain terminal boundary conditions for easier simulation of touch screens and MEMS devices are now available. Ray tracing simulations can combine graded index and constant index materials in meshed and unmeshed domains. The new Optical Aberration plot type is dedicated to measuring monochromatic aberrations. Two-port-networks, fast-frequency sweeps, and non-linear frequency-mixing are available for high-frequency electromagnetics analysis.

COMSOL numerical simulation of a wetted transient time-of-flight ultrasound flow meter. Ultrasound signal propagating in the device is shown at different time steps. The steady-state background flow in the flow meter is computed first. The Convected Wave Equation, Time Explicit physics interface is then used to model the ultrasound signal propagating in the device. The interface is based on the discontinuous Galerkin method (DG).

Design and manufacturing engineers working across all industries will benefit from the new adhesion and de-cohesion feature as they analyse various processes involving mechanical contact with parts sticking together and pulling apart. A new physics interface for modelling linear and non-linear magnetostriction is also available. Heat transfer users can now access a meteorological database from 6000 weather stations and model fluid, solid, or porous media thin structures.

Users modelling fluid flow with buoyancy will appreciate the new gravity property for density variations, which simplifies the set up of natural convection applications where density may vary depending on temperature, salinity, or other variables. Pipe flow simulations can now benefit from the advanced pump curves. For chemical simulations, surface reaction in reactive pellet beds and a new reacting flow multiphysics interface are available. Battery manufacturers and designers can now model complex 3D assemblies in battery packs using the new single particle battery interface. Discharge and recharge behaviours are supplied by the single particle model at every point in the geometry. This makes it possible to estimate the geometrical current density distribution and the local state of charge in the battery pack.

Highlights of New Features and Tools Available in Version 5.2a

• COMSOL Multiphysics, Application Builder, and COMSOL Server: The appearance of the user interface of simulation apps can change during run time. Centralized unit handling to better serve teams working across different countries is supported. Hyperlinks and videos can now be included. A new Add Multiphysics window makes it easier for users to create multiphysics models incrementally by providing a list of available predefined multiphysics couplings for the selected physics interfaces. Autocomplete has been expanded to many fields including the equation view fields.
• Geometry and Mesh: The enhanced tetrahedral meshing algorithm can now easily create coarse meshes for complicated CAD geometries that feature many thin parts. A new optimization algorithm built into the mesher is available for improving element quality, which may improve the accuracy of a solution and make it faster to converge. Interactive drawing for 2D geometries now features better coordinate display and snapping points.
• Mathematical Modelling Tools, Studies, and Visualization: Three new solvers are introduced: the smoothed aggregation algebraic multigrid method (SA-AMG), the domain decomposition solver, and the discontinuous Galerkin (DG) method. Users can now save data and plots added to the Export node under Results in VTK format, making it possible to import COMSOL simulation results and meshes to 3rd party software.
• Electrical: The AC/DC Module now features a material model for magnetic hysteresis built-in called Jiles-Atherton. The new lumped two-port network coupling is introduced in the RF Module, allowing for lumped modelling to represent parts of a microwave circuit in a simplified way without having to model the details.
• Mechanical: The Structural Mechanics Module includes the new adhesion and de-cohesion features, available as a subnode under the Contact feature. A Magnetostriction physics interface that supports both linear and nonlinear magnetostriction is now available. The nonlinear material modelling capabilities have been expanded with new plasticity models, mixed isotropic and kinematic hardening, and large-strain viscoelasticity.
• Fluid: The CFD Module and Heat Transfer Module now include a feature that adds a gravity force and concurrently compensates for the hydrostatic pressure on boundaries. A new linearized density option in Non-Isothermal Flow, a common simplification for natural convection flows, is now available.
• Chemical: Battery manufacturers and designers can now model complex 3D assemblies in battery packs using the Single Particle Battery physic interface available in the Batteries & Fuel Cells Module. Additionally, a new Reacting Flow Multiphysics physics interface is now available.

Using COMSOL Multiphysics, Application Builder, and COMSOL Server, simulation specialists have access to a fully integrated software environment to create applications that will best serve their specific industry in a dynamic, easy to use, quick to implement format that can be scaled for global benefit.

Availability

To watch the release highlights video and download COMSOL Multiphysics and COMSOL Server software version 5.2a , visit www.comsol.com/release/5.2a

About COMSOL

COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics product is an integrated software environment for creating physics-based models and simulation apps. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electrical, mechanical, fluid flow, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics simulations with all major technical computing and CAD tools on the CAE market. Simulation experts rely on the COMSOL Server product to deploy apps to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL employs more than 400 people in 22 offices worldwide and extends its reach with a network of distributors. For more information, visit www.comsol.com.

COMSOL Announces Simulation Apps Support of 5G, IoT

BURLINGTON, MA, USA, May 25, 2016 - COMSOL, the leading provider of multiphysics modelling, simulation, and application design software, has announced support for app development that furthers work toward 5G and the IoT. Several of these application examples will be introduced at the International Microwave Symposium (IMS) 2016. The COMSOL Multiphysics software and its Application Builder provides simulation experts with the tools needed to turn their detailed physics and mathematical models into easy-to-use simulation apps for use by everyone in their organization and beyond. “We wanted to show designers how easy it is to build a customized easy-to-use interface based on their detailed model in order to let anyone in product development test different operating conditions and configurations,” said Jiyoun Munn, technical product manager of the RF Module at COMSOL.

This app created with COMSOL Multiphysics, simulates a single slot-coupled microstrip patch antenna fabricated on a multilayered low temperature co-fired ceramic (LTCC) substrate. Users may control inputs such as properties of a single antenna and array geometry. Results show the far-field radiation pattern of the antenna array and its directivity.

This app created with COMSOL Multiphysics, simulates a single slot-coupled microstrip patch antenna fabricated on a multilayered low temperature co-fired ceramic (LTCC) substrate. Users may control inputs such as properties of a single antenna and array geometry. Results show the far-field radiation pattern of the antenna array and its directivity.

As we work toward 5G and the Internet of Things (IoT), designers of RF and microwave devices will benefit from multiphysics modelling and simulation of antennas and circuits, not limited to RF and microwaves but extending to the range of millimetre waves and Terahertz. The latest release of the RF Module in COMSOL Multiphysics comes with several application examples that allow COMSOL software users to run, inspect, and use the apps – allowing them to see how straightforward it is to turn their model into a custom application.

Of interest to antenna designers is the Slot-Coupled Microstrip Patch Antenna Array Synthesizer demo app, pictured here. It simulates an FEM model of a device that is fabricated on a multilayered low temperature co-fired ceramic (LTCC) substrate, and extends the results to the user-specified array configuration.

The results include S-parameter, electric field distribution on each layer, far-field radiation pattern of the antenna array, and its directivity. The far-field radiation pattern is calculated by multiplying the array factor and the single antenna radiation pattern to perform an efficient far-field analysis without simulating a complicated full array model, allowing the app user to independently obtain their simulation results within seconds. “Given how competitive the race is to deliver the best 5G solutions, building simulation apps for an entire team will allow designers to share their expertise easily and free up resources to develop new concepts,” adds Munn.

Using COMSOL Multiphysics, microwave and RF designers can couple electromagnetic simulations with heat transfer, structural mechanics, fluid flow, and other physical phenomena, allowing them to represent coupled physics effects as they would occur in the real world. That means being able to accurately investigate designs and fully benefit from the virtual prototyping capabilities COMSOL offers.

The upcoming version of the RF Module, which is scheduled to be released shortly after the International Microwave Symposium (IMS) 2016, strengthens its design and test feasibility by including new tutorial models such as a log-periodic antenna for EMI/EMC Testing, and a signal integrity (SI) and time-domain reflectometry (TDR) analysis of adjacent microstrip lines. The Application Libraries also include detailed model examples guiding users to perform very fast prototyping with high accuracy through reduced-order model simulation techniques based on asymptotic waveform evaluation (AWE) and frequency-domain modal methods.

About COMSOL

COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics product is an integrated software environment for creating physics-based models and simulation apps. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electrical, mechanical, fluid flow, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics simulations with all major technical computing and CAD tools on the CAE market. Simulation experts rely on the COMSOL Server product to deploy apps to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL employs more than 400 people in 22 offices worldwide and extends its reach with a network of distributors. For more information, visit https://www.comsol.com.

ANSYS 17.1 Expands System Simulation, Immersive Multiphysics

PITTSBURGH, USA, May 16, 2016 - Engineers can optimize system performance for next-generation products quicker and easier with the newly released ANSYS 17.1. Building upon the 10x improvements in performance and productivity delivered in ANSYS 17.0, engineers can tap into new system-wide simulation capabilities to optimize system performance early on in the design process thanks to enhancements made across ANSYS’ core solutions. Using simulation early in the product design cycle enables organizations to reduce product time-to-market by 9x, minimize cost by 4x and maximize quality by correcting any design flaws early in the design phase. 17.1 takes another big step forward towards ANSYS vision of full virtual prototype.

Model, Simulate and Analyze Virtual System Prototypes with System Simulation

As products become more complex, the ability to simulate entire systems - including mechanical, electronics, and software - provides a significant advantage. This enables engineers to optimize for the individual components as well as for the combined behaviour in the full system. With ANSYS 17.1 engineers can quickly create physics-based component models and embedded software designs for complete virtual prototypes of multi-domain systems. ANSYS 17.1 provides detailed physics models in combination with embedded software and complex behavioural models of components to perform complete product evaluation early in the design process – enabling organizations to accurately predict how a product will perform in real world conditions. By identifying potential issues early in the development process before design choices are solidified, costly late-state changes can be avoided.

ANSYS AIM Redefines Ease of Use and Intuitive Simulation with New and Extended Physics

More engineers than ever before can now reap the benefits of the markets best and most trusted simulation technology using the latest version of ANSYS AIM. Built for design engineers, AIM is an integrated, easy-to-use simulation environment based on proven ANSYS solver technology. In addition to newly extended structural and fluid flow simulation capabilities, ANSYS AIM now provides product designers with magneto-statics and coupled magnetic-thermal-structural analysis to rapidly design innovative electromechanical products. New polymer extrusion simulation enables designers to identify manufacturing issues early on and reduce tooling lead time. ANSYS 17.1 boosts the customization and automation capabilities of AIM by introducing multi-step custom templates that allow accurate and repeatable simulation methods to be codified and deployed during early stages of product design – reducing product development time and cost.

Enhancements Across All Engineering Disciplines

In addition to the advancements in system simulation and multiphysics, engineers can take advantage of several new enhancements ANSYS 17.1 delivers across the entire portfolio and ANSYS Workbench platform. ANSYS’ electronic technology for antenna and wireless modelling empowers engineers with extended models and design flow automation – enabling organizations to meet the growing demands of the Internet of Things and wireless device markets.

Designing and routing cable structures to meet electromagnetic compatibility standards and packaging requirements in large automotive or aeronautical systems has become increasingly complex and make traditional design rules obsolete. The ANSYS 17.1 electronics suite is equipped with new innovations to efficiently analyze signal integrity through complex cable paths.

In the fluids suite, engineers can prepare large and complex models – from aerospace to under-hood simulations easier thanks to the new fully integrated toolset to navigate, display and manage large computer-aided design datasets. Also new to the fluids suite is cyclic and polar plots that display the results of a transient row analysis, making it easier for users to understand and communicate transient periodic behavior, commonly found in turbomachinery simulations due to blade row interaction.

Building upon the solutions for simulating large fabricated structures, the ANSYS mechanical suite offers new beam-to-solid and shell-to-solid sub-modelling. Now structural engineers can easily convert lower dimensional models used in early design stages to high fidelity 3-D models for a detailed investigation of critical areas. In addition to the performance enhancements across its product lines, ANSYS 17.1 delivers performance improvements for motion analysis. Systems with large number of contacting and sliding parts, such as chain drives and gear assemblies, solve 10 to 20 times faster using new innovations in time stepping schemes and the implementation of mesh based contact detection.

ANSYS semiconductor process technologies have kept in-step with new advancements to enable customers to innovate mobile, computing, networking and IoT applications. Overall simulation runtime performance has been improved by up to 30 percent with a 2x reduction in memory footprint by harnessing distributed machine processing technology for transistor-level analog and mixed signal designs including memory. ANSYS also now supports thermally aware electromigration analysis, enabling users to design with FinFET transistor technology. To further improve low-power chip design, ANSYS 17.1 delivers faster power analysis, better accuracy and greater reduction of power, enabling customers to deliver smaller, higher-power density devices to market faster.

For more details about the release, please visit click here. Current customers can now download ANSYS 17.1 from the Download Center on the ANSYS customer portal.

About ANSYS, Inc.

ANSYS is the global leader in engineering simulation. We bring clarity and insight to our customer's most complex design challenges through the broadest portfolio of fast, accurate and reliable simulation tools. Our technology enables organizations in all industries to imagine high-quality, innovative product designs that are sustainable and have an accelerated time to market. Founded in 1970, ANSYS employs almost 3000 professionals, more than 700 of them with PhDs in engineering fields such as finite element analysis, computational fluid dynamics, electronics and electromagnetics, embedded software, system simulation and design optimization. Headquartered south of Pittsburgh, PA,  U.S.A., ANSYS has more than 75 strategic sales and development locations throughout the world with a network of channel partners in 40+ countries. For more information, visit www.ansys.com.

ANSYS also has a strong presence on the major social channels. To join the simulation conversation, visit: www.ansys.com/Social@ANSYS.

COMSOL News 2016 Multiphysics Simulation Online Magazine Available

BURLINGTON, MA, USA, May 10, 2016 - COMSOL, Inc. has published the latest edition of COMSOL News, the company’s annual multiphysics journal reporting on its customers innovative applications. The 2016 edition focuses on simulation specialists bringing multiphysics to everyone so companies can easily develop, clearly communicate and readily distribute designs across teams and client bases.

COMSOL News 2016 reports on how custom applications built using the COMSOL Multiphysics software allow cross-team collaboration; and how the COMSOL Server product enables the distribution of these applications for colleagues and customers to use. Industry experts explain how they harness COMSOL software to create detailed physics-based models and deliver on innovative product development and research projects; from designers and engineers at NASA investigating combustion instability in rocket engines, to a research group at the University at Buffalo designing simulation apps for use across a wide variety of industries such as, 3D printing and traffic control.

The latest COMSOL News issue features more than a dozen articles in this year’s 40-page edition, which cover a diverse range of projects. These include pieces on ABB engineers using the COMSOL Multiphysics software to predict and minimize the noise levels in their transformers; students and consultants collaborating to save historic structures and artifacts with the use of simulation apps; and simulation specialists creating virtual testing apps for furniture manufacturers.

Guest editorial is provided by Dr. Carl Meinhart, a professor of Mechanical Engineering at the University of California, Santa Barbara and founder and CEO of Numerical Design, Inc. Dr. Meinhart gives insight into how the COMSOL Multiphysics software is used in both academia and industry to solve complex multidisciplinary problems. “The reason is simple: What would previously require a custom numerical algorithm, from advanced multiphysics applications to optimization analysis, can be easily solved by COMSOL software,” he said. “With COMSOL, we are able to quickly simulate and analyse many design concepts, and optimize the designs, before committing to actual hardware fabrication.”

COMSOL News 2016 highlights the innovative work done by COMSOL software users including a computational app for testing new oil spill cleanup techniques using hydrophobic meshes and research into man made stars at the MIT Plasma Science and Fusion Center using numerical simulations to evaluate and optimize the proposed design of a compact nuclear fusion machine.

Availability

COMSOL News 2016 is available as an online magazine and can be viewed digitally or downloaded in PDF format at, www.comsol.com/offers/comsol-news-2016.

About COMSOL

COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics product is an integrated software environment for creating physics-based models and simulation apps. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electrical, mechanical, fluid flow, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics simulations with all major technical computing and CAD tools on the CAE market. Simulation experts rely on the COMSOL Server product to deploy apps to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL employs more than 400 people in 22 offices worldwide and extends its reach with a network of distributors. For more information, visit https://www.comsol.com.

COMSOL Expands Shanghai Office

BURLINGTON, MA, USA, Dec 17, 2015 - COMSOL, the leading provider of multiphysics modeling, simulation, and application design software, announced the expansion of its office in Shanghai, China. A larger facility enables continued expansion and recruitment of technical and sales staff to keep pace with the growing COMSOL software user base in China and increasing demand for COMSOL Multiphysics and COMSOL Server products. Services in Shanghai include sales, technical support, training sessions, and on-site workshops and customer visits.

“We are very excited to expand our office in Shanghai,” said Lei Chen, Managing Director of COMSOL Co., Ltd. in Shanghai. “Training sessions in areas such as multiphysics, mechanical, electrical, chemical and fluid flow will be offered in our new in-house educational facility to teach customers new to COMSOL Multiphysics and COMSOL Server products. More office space also allows us to expand our technical support team to better assist our customers in China. Additionally, we are expanding our localization team to provide more technical material (documentation, model examples) in Chinese.”

The Shanghai office expansion coincides with the latest release of COMSOL Multiphysics with a more powerful Application Builder and COMSOL Server. The new version provides simulation experts with a cutting edge user experience in simulation app design and app sharing by integrating highly productive model building, app design, and deployment tools that allow their simulation applications to be shared with users everywhere. With the Application Builder, companies can communicate across multiple departments, knowing that the simulation specialist is able to maintain control, enforce quality standards, and ensure that the results can be trusted.

“Expansion of COMSOL Shanghai office allows us to increase our high quality technical team to support the fast-growing COMSOL community in China,” said Gang (Martin) Wang, Technical Director of COMSOL Co., Ltd. in Shanghai. “Our applications team is dedicated to helping our users learn how to use COMSOL Multiphysics and COMSOL Server and build a wide array of easy-to-use yet powerful simulation apps.”

About COMSOL

COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs, and universities. Its COMSOL Multiphysics product is an integrated software environment for creating physics-based models and simulation apps. A particular strength is its ability to account for coupled or multiphysics phenomena. Add-on products expand the simulation platform for electrical, mechanical, fluid flow, and chemical applications. Interfacing tools enable the integration of COMSOL Multiphysics simulations with all major technical computing and CAD tools on the CAE market. Simulation experts rely on the COMSOL Server product to deploy apps to their design teams, manufacturing departments, test laboratories, and customers throughout the world. Founded in 1986, COMSOL employs more than 400 people in 22 offices worldwide and extends its reach with a network of distributors. For more information, visit http://www.comsol.com/.